Papers by Keyword: Thermoelectric Device

Abstract: Poly-Silicon nanowire (Poly-Si-NW) simulations are very important field of nanotechnology and nanostructures; in this paper presented review in general nanowire and it applications such as thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting and many more applications in this field .COMSOL multiphysics is one of programmers using for nanotechnology and nanowires simulation, hence in this review paper, COMSOL simulation with different types of materials using for nanowire and other structures. Also In this work, we explore the effect of the electrical contact resistance on the performance of a TED. COMSOL simulations are performed on Poly-SiNW to investigate such effects on its cooling performance. Intrinsically, Poly-SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.

Abstract: Thermal fluids are served to give the greater ΔT to the thermoelectric (TE) junctions. For the larger power generation using a limited number of modules and the limited amounts of thermal fluids, the multi-layered TE panels can save the occupied space effectively. Because the temperatures of the fluids vary along the planer TE panels due to heat exchange through the panels, the directions of fluids is important to obtain the larger output power, P, from a TE power generator. The methods to stack a few long planer TE panels and to determine the fluid directions are mathematically studied from the steady-state heat exchange. P for various kinds of fluid directions are calculated. P commonly shows the maximum against the panel length because of the balance between the internal resistance and ΔT. This maximum of P can be further maximized by choosing the counter flow. The non-dimensional analysis predicts that two fluids should flow in counterwise. When two series of fluids are used, the circulation method is another key issue for the optimal TE design.

Abstract: In this study, we designed a suitable electrode material was designed, Cu-W alloy, which achieved a good thermal match with CoSb3 thermoelectric (TE) material. By means of spark plasma sintering (SPS), Cu-W alloy was introduced into CoSb3/Ti/Cu-W TE element successfully. Finite element analysis showed that the maximum thermal residual stress appeared at the cylindrical surface zone close to the CoSb3/electrode interface. SEM and EPMA results showed that an intermetallic compound (IMC) layer formed at the CoSb3/Ti interface and EDS analysis confirmed the IMC layer was TiSb phase. Shear tests showed that the shear strength of CoSb3/Ti/Cu70W30 joint was about 50Mpa. The potential profile of the interface area was measured by the four-probe method and the result showed no abrupt change in voltage was found around the interface. The high temperature reliability evaluation showed the joint had high thermal duration stability.