Papers by Keyword: Thick Film Technology

Abstract: This paper presents a verification of technology aspects for improvement of field effect capacity type gas sensor parameters by using laser micromilling technique for fabrication ceramic surface mounting device (SMD) package and microheater for sustentation working temperature of metal-insulator-semiconductor structure (MIS structure). Innovative claims include: demonstration of flexible opportunities for new digital fabrication process flows based on laser micromilling tech: fast design of SMD sensor 3-D model, flexible changing topology of microheater, thick and thin film technology combination for reducing of power consumption. The results show possibility to fast fabrication functional sensor in customer ceramic SMD package with base 9x9 mm with twice reduced power consumption and improving mechanical properties compare with classical metal-glass microelectronic packages using before for such type sensors.

Abstract: This paper presents a modeling of technology aspects for fabrication ceramic microelectromechanical systems (MEMS) microhotplate and surface mounting device (SMD) packaging for (MOX) gas sensors applications. Innovative claims include: demonstration of flexible opportunities for new fabrication process flows based on laser micromilling tech; modeling of power consumption MEMS microhotplate depending on the thickness and topology; demonstration of necessity changing thick film technology of metallization to vacuum sputtering by reducing of power consumption. The results show possibility to fast fabrication of different topologies for ceramic MEMS microhotplate in form-factor of SOT-23 type SMD package.

Abstract: A Dissolved Oxygen (DO) sensor has been designed and fabricated on an 8.5 x 22.5 mm Alumina substrate using thick film technology. The structure of the sensor device consisted of AgPd working/counter electrode, Ag/AgCl reference electrode, RuO₂ active layer, KCl electrolyte, and TiO₂ membrane. Formation of the Ag/AgCl reference electrode was done by chlorination of Ag layer using FeCl₃, and the TiO₂ membrane was formed by screen printing of TiO₂ paste. Measurement was done to study the sensor’s performance based from the current-voltage characteristics between 1.1 – 1.6 V. The results showed that a stable diffusion current was obtained when the input voltage was 1.4 V, resulting in the best sensor performance with a sensitivity of 0.560 μA l/mg and a stable step response time of 4 min. The device showed highly potential to be used as candidate for online water quality monitoring system.

Abstract: A thick film anemometer for in situ control of the flow rate in fluidic systems was designed, manufactured and characterized. The sensor is integrated in a retention modulus consisting of Low Temperature Cofired Ceramics (LTCC). These materials allow the cost-effective realisation of fluidic microsystems with integrated electronics. The challenge of the work is to design an anemometer under the exclusive use of thick film technologies. The necessity to trim resistors causes the external use of relevant pastes. Therefore, the use inside of a closed fluidic system requires the leak of process gases and, at the same time, a maximal heat-insulating of the sensor element from the substrate. Free-standing elements necessitate the control of stress due to shrinking mismatch, TCE mismatch, density gradients and deformation during the lamination. In the presented solution, embossed flue channels prevent blow forming on a free-standing bridge. The anemometer has a linear sensor characteristic for flow rates up to 0.1 ml/min. The layout guarantees that the fluid gets only in contact with the basic ceramic material, which is compatible with a wide range of biological substances. Therefore the sensor is applicable in contact with cell fluids or PCRreagents.