Papers by Keyword: Threading Screw Dislocation

Abstract: Accurate characterization of dislocations is crucial for optimizing the performance of SiC-based power devices. The traditional way to measure dislocation density in SiC industry is KOH etching, a destructive approach that makes the wafer no longer available for epitaxial growth. Another major limitation of this technique is the accuracy of the data since some dislocations can be hardly recognized. For example, the etch pit of threading screw dislocation is similar to that of threading edge dislocation, both of which are usually in hexagonal shape while the primary difference is the size. However, those challenges and limitations in KOH etching do not exist in X-ray topography. In this paper, the non-destructive approach, X-ray topography, is introduced to characterize dislocations in 4H-SiC industry. Threading screw dislocations were measured by both KOH etching and X-ray topography, the result of which indicates that some threading screw dislocations clearly visible in X-ray topograph are not recognizable in KOH etching image. In addition, some 60° prismatic dislocations not recognized in KOH etching image can be observed in X-ray topographs. Moreover, unlike destructive KOH etching, wafers measured by X-ray topography can be further used for annealing, epitaxial growth, ion implantation and etc., which is beneficial to SiC fundamental research.

Abstract: In this study, we investigated the origin of line-shape defect in 4H-SiC epitaxial wafers. The inspection results revealed that such defects resulted from the substrate entirely and accompanied with dislocation lines during the epitaxial process. Although the defect surface condition with nanometer level of roughness seemed to do little harm to the initial electrical characteristics of power devices, dislocation lines possibly resulted in high leakage current when reverse voltage was applied. To reduce line-shape defects, it is essential to reduce defects and threading dislocations in substrates and to develop a nondestructive method for wafer screening.

Abstract: Phase contrast microscopy (PCM) technique was demonstrated as the effective non-destructive discrimination method of TSDs and TEDs in 4H-SiC epitaxial layers in comparison with conventional polarized light microscopy, PL topography, KOH etch pit inspection and X-ray topography. The appearance of TSDs and TEDs by the PCM method is subtly modified by not only the consisting burgers vector but also the crystalline quality of the epitaxial layer or the substrate as the background. To extract more detailed information on the dislocations, the PCM inspection requires further investigation.

Abstract: The growing demand for power electronic device for automotive, photovoltaic, transportation, motor drives creates an enormous demand for widebandgap semiconducting materials such as silicon carbide (SiC) and gallium nitride (GaN). While GaN based devices can be used for low voltages, SiC is the workhorse for voltages >600. Progress in the availability of larger diameter SiC wafers has driven the final cost of device assembly down. In this paper we compare different growth techniques for growing high quality SiC crystals, technology adaption and road to low cost SiC materials. GT Advanced Technologies has been involved in SiC sublimation equipment manufacturing since the year 2000 and the results from our 100 mm and 150 mm SiC crystals show high epi-quality.

Abstract: We have developed the bulk growth technique to reduce threading screw dislocations (TSDs) by combining solution growth and PVT growth methods. More than 80 % of TSDs in original seed crystals were successfully converted to Frank defects on basal planes by the solution growth on 4° off C-face with Si-5at.% Ti solvent. After PVT growth on the as-grown surface of the conversion layer, TSDs in the original seed were successfully reduced. The presence of micrometer-size macrosteps in the initial stage of PVT growth is important to continue to propagate the converted Frank defects on basal planes during PVT bulk growth.

Abstract: Shifts in the spatial distribution of threading dislocations in 150 mm 4H SiC wafers were examined as a response to intentional changes in both the flow of the nitrogen source gas used to control resistivity during bulk crystal growth, and the growth rate. The density of threading edge and screw dislocations was found to be more evenly distributed in wafers produced under a high-growth rate, low-resistivity process. This result corresponded to a flattening of the resistivity distribution, and a ~34% reduction in on-and off-facet resistivity differential. The effect was attributed to regularized 4H island coalescence due to modulation of step terrace width.

Abstract: In this work, aggregate epitaxial carrot distributions are observed at the crystal, wafer and dislocation defect levels, instead of individual extended carrot defect level. From combining large volumes of data, carrots are observed when both threading screw dislocations (TSD) and basal plane dislocations (BPD) densities are locally high as seen in full wafer maps. Dislocation density distributions in areas of carrot formation are shown, and suggest TSD limit the formation of carrots in regions containing BPD. These data also add support for mechanisms requiring the need for both dissociated BPD and TSD for carrot formation.

Abstract: The commercial availability of high quality 150 mm 4H SiC wafers has aided in the growth of SiC power device fabrication. The progress of 150 mm 4H SiC wafer development at Dow Corning is reviewed. Defect densities compare well to those typical for 100 mm wafers, with even lower threading screw dislocation densities observed in 150 mm wafers. Resistivity data shows a comparable range from 0.012 – 0.025 ohm.cm, and excellent shape control is highlighted for wafer thicknesses of 350 μm and 500 μm.

Abstract: We observed fine surface morphology of silicon carbide wafers using a low energy scanning electron microscope (LESEM). Typical kinds of surface defects were observed by LESEM. After low temperature KOH treatment, it is confirmed that positions of etch pits are the same positions of these defects. Correlation between LESEM imaging and cross-sectional scanning transmission electron microscopy (STEM) of the same defects reveals threading dislocations and basal plane dislocations at the core of the defects.

Abstract: A reduction in threading screw dislocation (TSD) density in 4H-SiC (silicon carbide) crystal is required for SiC power devices. In this study, TSD’s transformation by the RAF (repeated a-face) growth method [1] is observed by transmission X-ray topography (g=0004) of the cross-section of the crystal. Increasing the number of repetitions of a-face growth and offsetting c-face growth to an angle of several degrees reduce TSDs. TSD density is reduced to 1.3 TSD/cm2. The RAF growth method is very effective towards growing high quality SiC crystals.