Papers by Keyword: Ti-Ni-Cu

Abstract: Presented work summarizes studies done on the course of the martensitic transformation in the Ti50Ni25Cu25 alloy. Studies were carried out using scanning electron microscopy JEM 6480 equipped with an electron back scattered detector (EBSD) as well as a heating attachment. As-received ribbon was mainly amorphous. At the free side of the ribbon some fine randomly oriented crystalline grains were formed. During heating followed by cooling the reversible martensitic transformation occurred with sequence: B2↔B19. The crystallographic correlation between the B2 phase and the B19 martensite were confirmed. It allowed finding transformation matrix between both phases.

Abstract: Ti-Ni-Cu shape memory alloy (SMA) thin films were sputter-deposited on heated polyimide substrates. The (Ni,Cu) rich Ti-Ni-Cu films deposited at a substrate temperature of 543 K were found to possess a high martensitic transformation temperature above room temperature over a wide range of Cu content from 7 to 23 at%, which allows stable production of actuators that operate at room temperature. Additional deposition of a Cu film onto the Ti-Ni-Cu films facilitated the soldering of wires onto the actuators and also decreased the power consumption and response time of the actuator. The force of a polyimide/Ti-Ni-Cu SMA actuator could be increased merely by increasing the thickness of the polyimide film. An actuator composed of a 125 m thick polyimide film and an 8 m thick TiNiCu film was able to lift a 13.5 g weight. Furthermore, a Ti-Ni-Cu film could be pattern etched on a polyimide film to produce a circuit. The results indicate that a polyimide/SMA film actuator is a promising simple actuator that can be produced by simply cutting out an appropriately shaped piece with scissors or by punching and then connecting the two edges to a battery by soldering.