Papers by Keyword: Ultra-Precision Lapping

Abstract: To obtain the amorphous alloy films with superior properties by method of electrochemical deposition, the accuracy requirement for the copper substrates for Alloy Films is extraordinarily strict. The ultraprecision lapping technology for the copper substrate employing polyurethane polishing pad and flannel pad is studied in this paper, surface roughness, material removal rate and change process of surface construction of copper substrates are discussed. The influences of the different lapping parameters on the surface roughness, material removal rate and the influences of lapping load on copper substrate surface formation in the ultraprecision lapping process of copper substrate are both discussed. Experiment results show that the surface scratch will disappear by employing polyurethane polishing pad and flannel pad, and an extremely smooth surface of copper substrate with roughness 6nm Ra is obtained in the final finishing lapping process.

Abstract: The ultra-precision lapping processes to obtain the damage-free surfaces at Å level surface roughness of Potassium titanyl phosphate (KTiOPO4, KTP) crystal is studied in this paper. The influence of the lapping parameters on the stoke removal rate and surface roughness and material removal mechanism in the process of ultra-precision lapping process is discussed, and the evolution of the lapped surface is also observed with electric telescope. A super-smooth surface of quartz crystal with roughness Ra 0.8667 Å has been obtained by adopting the fine SiO2 abrasive powders and the elastic polyurethane pad in this study.