Papers by Keyword: Void Defect

Abstract: According to MD simulation results, pressing depth between two bonding materials will affect bonding strength. Alloy material (Al0.9Cu0.1) had void defect phenomenon in low bonding speed condition because the increasing chance of atom migration which will result in low bonding strength. High tensile speed causes material fracture phenomena happen earlier than low speed. Material stress in low speed is smaller than in high speed. Fracture morphology of material is different in different tensile speed. In low speed condition, material can be stretched thinner than in high speed condition. Material in high temperature has greater kinetic energy than low temperature; therefore, material in high temperature has better formability and behaves larger tensile strain than low temperature. For pure aluminum, when temperature raises to 900K which is close to melting point (933K), its crystal structure is no longer belongs to F.C.C. structure, so bonding strength is weaker than low temperature. Large size material has larger contact area than small size material; therefore, the tensile force and tensile strength of the former are larger than the latter. The order of bonding strength for these three materials is: binary alloy > pure copper > pure aluminum.

Abstract: According to MD simulation results, pressing depth between two bonding materials will affect bonding strength. Alloy material (Al0.9Cu0.1) had void defect phenomenon in low bonding speed condition because the increasing chance of atom migration which will result in low bonding strength. High tensile speed causes material fracture phenomena earlier happen than low speed. Material stress in low speed is smaller than in high speed. Fracture morphology of material is different in different tensile speed. In low speed condition, material can be stretched thinner than in high speed condition. Material in high temperature has greater kinetic energy than low temperature; therefore, material in high temperature has better formability and behaves larger tensile strain than low temperature. For pure aluminum, when temperature raises to 900K which is close to melting point (933K), its crystal structure is no longer belongs to F.C.C. structure, so bonding strength is weaker than low temperature. Large size material has larger contact area than small size material; therefore, the tensile force and tensile strength of the former are larger than the latter. The order of bonding strength for these three materials is: binary alloy > pure copper > pure aluminum.

Abstract: Simulation method of void defect evolvement during the forging of steel ingot was determined by comparing simulated and experimental results of void closure in the cylinder specimens during forging. Calculation results of long and short void defect evolvement during forging indicated that effective strain required for void closure was induced by the integration of stress. The closure of tetrahedral void is the most difficult with the maximal values of critical reduction on void closure during forging, on the basis of which, theory basis is provided for making forging process.

Abstract: We present results from molecular dynamics simulations of shock-induced hydrodynamic void collapse in a model energetic crystal. During void collapse, hotspot formation is observed that leads to subsequent detonation. The hotspot formation mechanism is identified as shock energy focusing via jetting. There is another initiation mechanism that arises from the interaction of reflected shock waves with the rigid piston, which is considered to be an artifact. Such artifact can be eliminated by altering the location of the void. The detonation threshold as a function of the velocity of the driven piston is determined for various void geometries. It is found that a system containing a void has a lower detonation threshold than that of a perfect energetic crystal. The amount of reduction of the detonation threshold depends on the geometry of the void. For square voids, there exists a minimum size above which reduction of the detonation threshold occurs. Among voids that have an equal volume, the void that is elongated along the shock direction gives the lowest detonation threshold.