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Articles by keyword: «Wafer»

• 100 mm 4HN-SiC Wafers with Zero Micropipe Density
  Published in: Silicon Carbide and Related Materials 2007 (p7)
• Analysis of Impact on the Wafer Surface Performance of Supercritical CO₂ Extraction
  Published in: Materials Science and Engineering Applications (p704)
• Au-Si Eutectic Wafer Bonding Mechanism Analysis and a Intensity Model
  Published in: Nanoscience and Technology (p575)
• Classification of Defects on Semiconductor Wafers Using Priority Rules
  Published in: Defects and Diffusion in Semiconductors - An Annual Retrospective VII (p135)
• Defect Status in SiC Manufacturing
  Published in: Silicon Carbide and Related Materials 2008 (p3)
• Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing
  Published in: Advances in Abrasive Technology VIII (p389)
• High Throughput SiC Wafer Polishing with Good Surface Morphology
  Published in: Silicon Carbide and Related Materials 2006 (p753)
• Improvement of Machined Surface Quality in Ultra-Precision Plane Honing
  Published in: Advances in Abrasive Technology V (p137)
• Laser-Assisted CMP for Copper Wafer
  Published in: New Frontiers of Processing and Engineering in Advanced Materials (p351)
• Microstructural Analysis for Si Wafer after CMG Process
  Published in: Advances in Abrasive Technology IX (p367)
• Silicon Carbide Crystal and Substrate Technology: A Survey of Recent Advances
  Published in: Silicon Carbide and Related Materials 2003 (p3)
• Surfactant Selection for AM Clean in a Single Wafer Oasis Wet System
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p57)
• The Dislocation Density Distribution of Different Types of Doped InP Wafers
  Published in: Advances in Chemical Engineering (p425)
• Variation of Etch Pit Size by Screw Dislocation Tilt in 4H-SiC Wafer
  Published in: Silicon Carbide and Related Materials 2011 (p367)