Papers by Keyword: X-Ray Topography

Abstract: Several studies have been carried out regarding the influence of dislocations on device characteristics; however, most of them had been limited to pseudo-vertical structures using high pressure high temperature (HPHT) insulating material as the substrate. In this study, we have investigated the influence of dislocations to the devices using vertical structure SBD on p+ HPHT substrate. SBDs were selectively fabricated on specific dislocation areas. The SBD fabricated on the threading dislocation area indicated fatal influence of the dislocation on the device characteristics.

Abstract: The defect structure at the growth front of 4H-SiC boules grown using the physical vapor transport (PVT) method has been investigated using high resolution x-ray diffraction and x-ray topography. The crystal parameters such as the c-lattice constant exhibited characteristic variations across the growth front, which appeared to be caused by variation in surface morphology of the as-grown surface of the boules rather than the defect structure underneath the surface. X-ray topography also revealed that basal plane dislocations are hardly nucleated at the growth front during PVT growth of 4H-SiC crystals.

Abstract: Aluminum nitride (AlN) single crystal boules were grown by physical vapor transport (PVT). Diameter expansion during boule growth, without the introduction of low angle grain boundaries (LAGB) around the boule periphery, was confirmed by crossed polarizer imaging, synchrotron white beam x-ray topography (SWBXT), and synchrotron monochromatic beam x-ray topography (SMBXT). The densities of basal plane dislocations (BPD) and threading edge dislocations (TED) averaged from high-magnification topographs of five regions of a high-quality substrate were 0 cm^-2 and 992 cm^-2, respectively. Substrates fabricated from AlN boules possessed excellent surface finishes suitable for epitaxy.

Abstract: Synchrotron X-ray topography was carried out for 4H-SiC crystals grown by high-temperature gas source method, and transmission topography analysis with g= or 0004 was carried out for the cross-sectional samples. Dislocation contrasts extended in the growth direction were observed and the propagation behavior of threading screw dislocations (TSDs), threading edge dislocations (TEDs), basal plane dislocations (BPDs) and stacking faults (SFs) in the facet and step-flow regions were discussed. The propagation of dislocations in the fast grown crystal with a growth rate of 3.1mm/h was also evaluated by cross-sectional topography.

Abstract: X-ray topography shows that selective KOH etching after CVD growth of n-type epilayers on highly N doped 4H SiC substrates can be used to reliably map pure and mixed Threading Screw Dislocations (TSD). The influence of the mapping grid density and the wafer position in the crystal on the average TSD density are investigated. A reliable mapping of TSD contributed to the development of 100mm SiC wafers with average TSD density down to 200 cm^-2.

Abstract: The presence of threading mixed dislocations (TMDs) (with both edge and screw component) in 4H-SiC crystals grown by PVT method has been reported both from axial slices (wafers cut parallel to the growth axis) and commercial offcut wafers (cut almost perpendicular to the growth axis). In this paper, a systematic method is developed and demonstrated to unambiguously determine the Burgers vectors of TMDs in 4H-SiC commercial offcut wafers using both Synchrotron Monochromatic X-ray Topography (SMBXT) and Ray Tracing Simulations. The principle of this method is that the contrast of dislocations on different reflections varies with the relative orientation of Burgers vectors with respect to the diffraction vectors. Measurements confirm that in commercial offcut wafers the majority of the threading dislocations with screw component are mixed type dislocations.

Abstract: Synchrotron white beam X-ray topography studies carried out on 4H-SiC wafers characterized by locally varying doping concentrations reveals the presence of overlapping Shockley stacking faults generated from residual surface scratches in regions of higher doping concentrations after the wafers have been subjected to heat treatment. The fault generation process is driven by the fact that in regions of higher doping concentrations, a faulted crystal containing double Shockley faults is more stable than perfect 4H–SiC crystal at the high temperatures (>1000 °C) that the wafers are subject to during heat treatment. We have developed a model for the formation mechanism of the rhombus shaped stacking faults, and experimentally verified it by characterizing the configuration of the bounding partials of the stacking faults on both surfaces. Using high resolution transmission electron microscopy, we have verified that the enclosed stacking fault is a double Shockley type.

Abstract: Threading dislocations (TDs) in 4H-SiC have been studied by comparing etch pits formed by NaOH vapor etching with results of synchrotron monochromatic-beam X-ray topography (XRT) taken under different g-vectors. Burgers vectors determined based on XRT results were utilized to investigate the etch pit characteristics of edge (TED), screw (TSD) and mixed (Burgers vector b=c+a, TMD) threading dislocations. It has been found that pit formation by NaOH vapor etching was very different to that by conventional molten KOH etching. We discuss the possibility of using NaOH vapor etching to distinguish TMDs from TSDs, and report a variety of characteristic etch pits formed by this method and their correlations to dislocation behavior.

Abstract: We investigated the effect of the basal plane dislocation (BPD) density in 4H-silicon carbide (SiC) substrates on the forward voltage (V_sd) degradation of body-diodes. Using reflection X-ray topography, the BPD density was automatically estimated from the substrates prior to fabrication of metal–oxide–semiconductor field-effect transistors (MOSFETs). A strong positive correlation was found between the V_sd shift, which was calculated from the difference before and after forward bias stress at 160 A/cm² for ~500 hours, and the BPD density of the substrate. We show that it is possible to predict V_sd shifts from the BPD densities of SiC substrates prior to the fabrication of MOSFETs. In addition, we examined the origin of stacking faults (SFs) as a result of the application of forward bias stress. We presume that SFs are formed by BPDs converted to threading edge dislocations at the epi/sub interface, as well as by BPDs penetrating into the epitaxial layer.

Abstract: Synchrotron white beam x-ray topography (SWBXT), synchrotron monochromatic beam x-ray topography (SMBXT), and high resolution transmission electron microscopy (HRTEM) studies have been carried out on stacking faults in PVT grown 4H-SiC crystal. Their fault vectors were determined by SWBXT to be 1/3<-1100>, 1/2<0001>, 1/6<-2203>, 1/12<4-403>, 1/12<-4403>. HRTEM studies reveal their similarity in stacking sequences as limited numbers of bilayers of 6H polytype structure. Simulation results of the two partial dislocations associated with the stacking faults in SMBXT images reveal the opposite sign nature of their Burgers vectors. A mechanism for stacking fault formation via 2D nucleation is postulated.