Papers by Keyword: Zero Creep Method

Abstract: Grain boundary and surface tension for pure copper and copper-based alloys with Sb, Sn and In are measured by zero creep method. On the base of these and literature data, using the Shyshkovsky equation for a dilute solution, the isothermes of surface tension and grain boundary tension are constructed in Cu-based alloys with Sb, Sn, In and also Bi and Au. It is shown that all solutes are active on the surface tension of copper. The free energies of adsorption are negative and decrease in a following consequence: Bi, Sb, Sn, In, and Au.

Abstract: Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.

Abstract: Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.