Search for: «Crack; Mismatch of CTE; Thermal stress; FEM simulation»

p2900 Thermal Stress Distribution in the Corner of IC Package Structure
Authors: Hong Peng Li, Rong Shi, Yu Ting He, Heng Xi Zhang, Feng Li
p666 Numerical Simulation of Residual Stress in the Glass-to-Metal Diffusion Seals
Authors: Di Xu, Xiang Ling
A306 Effect of Thermal Activation on Dislocation Processes at an Atomistic Crack Tip
p941 Numerical Model for Thermal Cracking of Concrete
Authors: Shi Bin Tang, Chun An Tang, Zheng Zhao Liang, Qing Lei Yu
p1043 Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Authors: Yi-Ming Jen, Hsi Hsin Chien, Tsung-Shu Lin, Shih Hsiang Huang
A328 Interaction between Cracks and Inclusions
p625 Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents
Authors: Yong Tae Park, Yoo Kyoung Whang, Joon Ki Hong, Kwang Yoo Byeon
p1822 The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints
Authors: Jae Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
p645 A Study on the Thermoelastic Analysis in Shear Deformable Discontinuous Composites
Authors: Hong Gun Kim
p695 Surface Strengthening of Zirconia Toughened Alumina (ZTA) Using Glass Infiltration Technique
Authors: A. Balakrishnan, M.C. Chu, B.B. Panigrahi, K.J. Yoon, J.C. Kim, Byoung Cheon Lee, Taik Nam Kim, Seong Jae Cho