HOME CONTACT

Username: Password:

> @scientific.net

Search for: «SD»

• p382 Heavy Metal Leaching Behavior of Glasses Containing EAF Dust
  Authors: Hee Tai Eun, Seung Gu Kang, Yoo Taek Kim, Gi Kang Lee, Jung Hwan Kim
• p1599 Influence of the Surface Topography on the Micromechanical Properties and Performance of a CMP Finished AlN Component for Silicon Plasma Etching
  Authors: L. Chouanine, M. Takano, F. Ashihara, Osamu Kamiya
• A351 Ti: Grain Boundaries
• A80 Cu: Au, Se Grain Boundary Diffusion
• A153 Hf, Nb: Grain Boundary Diffusion
• A386 Cu: Au, Se Grain Boundary Diffusion
• A420 Hf, Nb: Grain Boundary Diffusion
• p629 Study of Mold Design on SD Card with 3D Mold-Flow Analysis
  Authors: Shih Miao Huang, Rong Yuan Jou, Jui Chang Lin, King Sun Lee
• p913 Case-Based Assembly Coordination Process Planning for Aircraft
  Authors: Kai Fu Zhang, Yuan Li, Xi Qiu, Hai Cheng Yang
• p1 Microstructure Characteristics of Spray-Formed and Melt-Spun Al85Nd5Ni10 and Al89La6Ni5 Bulk Hybrid Composites
  Authors: M.L.T. Guo, Chi Y.A. Tsao, J.C. Huang, Jason S.C. Jang