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• p245 Metal Enhanced Oxidation of Silicon
  Authors: M. Börner, N. Junghans, S. Landau, B.O. Kolbesen
• p233 Role of UV/Chlorine Exposure during Dry Surface Conditioning before Integrated Epi Deposition Process
  Authors: J. Ruzyllo, Erika Röhr, M. Caymax, M. Baeyens, Thierry Conard, Paul W. Mertens, Marc M. Heyns
• p249 Effect of Si Surface Roughness on the Current-Voltage Characteristics of Ultra-Thin Gate Oxides
  Authors: M. Houssa, T. Nigam, Paul W. Mertens, Marc M. Heyns
• p217 Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis
  Authors: Hidekazu Hayashi, Ken Tsugane, Yasushi Kagoshima, Takahisa Koyama, Masaharu Watanabe, Yasushi Kozuki
• p183 Wafer Backside Cleaning by Twin-Fluid Flow Cleaning
  Authors: Y. Tatehaba, Kazuo Kitagawa, Kunio Shimada, E. Ando
• p23 Electrical Impact of Various Arsenic-Residues Cleanings
  Authors: Y.S. Tan, S.P. Chiew, Z. Yang, Zainab Ismail, Felicia Goh, Christopher Lim, Vincent Sih, Ee Ping Yu, Goh Boon Cheng
• p241 Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing
  Authors: Rita Vos, E. Kesters, Sylvain Garaud, R. De Waele, Karine Kenis, Marcel Lux, H. Kraus, J. Snow, D. Shamiryan, Gabriela Catana, W. Deweerd, T. Schram, S. DeGendt, Paul W. Mertens
• p67 Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication
  Authors: Gyu Hyun Kim, Geun Min Choi, Young Wook Song
• p249 Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide
  Authors: Lucile Broussous, Pascal Besson, M.M. Frank, D. Bourgeat
• p221 The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning
  Authors: Kurt Wostyn, Vincent Quenette, Guy Vereecke, Paul W. Mertens