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p475 Microstructure Formation in Electrodeposition of Highly Supersaturated Cu-Pb and Ag-Pb Layers
Authors: Th. Barthel, P. Klimanek, Ch.J. Raub, A. Zielonka
p663 Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Authors: Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara
p367 A Method of Damage Mechanics Analysis for Solder Material
Authors: H.E. Fang, Chi Loong Chow, Fan Yang
p83 Effect of Glass Viscosity and Particle Size on Electric Resistivity of RuO₂-Glass Thick Film
Authors: A. Honda, Syunsuke Watanabe, H. Takagi, Yukio Sakabe
p131 Microstructure and Electric Properties of Sol-Gel PLZT Thin Films
Authors: Mineharu Tsukada, Jeffrey S. Cross, M. Fujiki, Kiyotaka Matsuura, H. Ashida, S. Otani
p267 Characterization of Strain Rate-Dependent Shear Response of 63Sn/37Pb Solder under Uniaxial Torsion
Authors: L.H. Dai, S.W.R. Lee, X.J. Huang
p589 An Internal Variable Approach to Superplasticity of Microduplex Pb-Sn Alloys
Authors: Tae Kwon Ha, Young Won Chang
p473 Embedded Lead Inclusions in Aluminium, Aluminium-Silicon Eutectic Alloys and Silicon
Authors: S. Hagège, L. Haas, P. Ochin, A. Dezellus, Ph. Plaindoux, J.C. Rouchaud
p69 Evaluation of Pb(Zr,Ti)O₃ Capacitors with Top SrRuO₃ Electrodes
Authors: Mineharu Tsukada, Jeffrey S. Cross, M. Fujiki, M. Tomotani, Y. Kotaka
p579 Phase Growth Between Copper and Different Tin Solders
Authors: S. Däbritz, D. Bergner, V. Hoffmann