Search for: «IMC»

p243 Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
Authors: Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto
p401 Reaction between Sn-In Solder and Under Bump Metallurgy
Authors: J.H. Choi, B.Y. Jung, S.W. Jun, Young Hee Kim, Tae Sung Oh
p633 Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing
Authors: Jong Woong Kim, Hyun Suk Chun, Sang Su Ha, Jong Hyuck Chae, Jin Ho Joo, Young Eui Shin, Seung Boo Jung
p893 Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging
Authors: Jeong Won Yoon, Chang Bae Lee, Seung Boo Jung
p2115 Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint
Authors: Yun Fu, Qi Zhang, Feng Sun, Hao Yu Bai
p801 Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows
Authors: Ja Myeong Koo, Young Ho Lee, Sun Kyu Kim, Myung Yong Jeong, Seung Boo Jung
p159 Analysis of the Intermetallic Compound Formed in Hot Dip Aluminized Steel
Authors: Kee Hyun Kim, Benny van Daele, G. Van Tendeloo, Yong Sug Chung, Jong Kyu Yoon
p554 TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
Authors: Jeong Won Yoon, Seung Boo Jung
p5 Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test
Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung
p2627 Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging
Authors: Soon Tae Kim, Joo Youl Huh