The compression simulation of LCD package indicates some potential design problems. Under large compression force the package will slope due to asymmetric deformation. The 3-D whole package parametric model was built in Pro/Engineer. Compression process simulation of package in Ansys will find design defects. Based on the simulation results, Ansys Design Exploration module generates the optimization design in accordance with the response surface analysis result. The compression simulation was performed to identify the reliability of the new design. In addition, some guidance on the cushion packaging parametric design and optimization was put forward.