Thermopiezoelectric Response of a One-Dimensional Functionally Graded Piezoelectric Medium to a Moving Heat Source - A Review


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The multi-physics of piezoelectric materials under different environmental conditions has been an active research subject for a few decades. Particularly, the thermoelastic behaviour of smart materials and structures is of great importance to their reliability in different applications. Traditionally, the Fourier heat conduction theory was introduced in dealing with the thermoelastic reactions of smart materials and structures. This may lead to reasonable analyses and useful guidelines in design of smart structures, especially when no severe thermal gradient is involved. However, when a severe thermal gradient is indeed involved in the service environment of a smart structure, the analysing results based on the Fourier heat conduction theory is unrealistic and usually rendered useless. Non-Fourier heat conduction theories have been introduced in the thermoelastic analysis of smart materials and structures in recent years and resulted in reasonable results. In this paper, we review the recent results of a thermopiezoelectric problem of a one-dimensional (1-D), finite length, functionally graded medium excited by a moving heat source using both the Fourier and Non-Fourier heat conduction theories. Numerical examples are displayed to illustrate the effects of non-homogeneity index, length and thermal relaxation time on the results.



Edited by:

Elwin Mao and Xibing Li




Z. T. Chen et al., "Thermopiezoelectric Response of a One-Dimensional Functionally Graded Piezoelectric Medium to a Moving Heat Source - A Review", Applied Mechanics and Materials, Vol. 151, pp. 396-400, 2012

Online since:

January 2012




[1] M.C. Majhi, J. Tech. Phys., Vol. 36 (1995), p.269.

[2] T. He, X. Tian, Y. Shen, Int. J. Eng. Sci., Vol. 40 (2002), p.2249.

[3] T. He, L. Cao,S. Li, J. Sound and Vibration, Vol. 306 (2007), p.897.

[4] M.H. Babaei, Z.T. Chen, Arch. Appl. Mech., Vol. 80 (2010), p.803.

[5] M.H. Babaei, Z.T. Chen, Smart Mater. Struct., Vol. 18 (2009), 025003 (9pp).

[6] A.H. Akbarzadeh, M.H. Babaei, Z.T. Chen, Int. J. Appl. Mech., Vol. 3 (2011), p.47.

[7] J.P. Tignol, Theory of algebraic equations, Wiley, New York, (1987).

[8] R.B. Hetnarski, M.R. Eslami, Thermal Stresses-Advanced Theory and Applications (Springer, Berlin, 2009).

[9] F. Durbin, F., Computer J., Vol. 17 (1974), p.371.