Research of Reliable Design of Printed Circuit Board Suited for Smart Grid

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Electric utilities faced with the prospect of increasing customer rates are seeking solutions to challenges presented by rising global energy demand, aging infrastructure, increasing fuel costs and renewable portfolio standards in light of climate change. Many consider Smart Grid to be one such solution. The most two significant characteristics of Smart Grid are self-healing ability and high reliability. As the bottom stage of development of Smart Grid communication system, the signal quality and self reliability of PCB design directly influence the entire performance of the communication system. This article focuses on analyzing reliable PCB design suited for Smart Grid communication system from power supply, thermal dispersion and trace routing.

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Edited by:

Mohamed Othman

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1503-1506

Citation:

C. Liu et al., "Research of Reliable Design of Printed Circuit Board Suited for Smart Grid", Applied Mechanics and Materials, Vols. 229-231, pp. 1503-1506, 2012

Online since:

November 2012

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$38.00

[1] Massoud Amin. Toward self-healing energy infrastructure system [J]. IEEE Computer Applications in Power, 2001, 14(1): 20-28.

DOI: https://doi.org/10.1109/67.893351

[2] Thermal management of power flip chip as in printed circuit board based electronic assemblies, Darrel Peugh, Delphi Delco Electronic System.

[3] J.E. Graebner. Thermal Conductivity of Printing Wiring Boards, Technical Brief, Electronics Cooling Magazine, Vol. 1, No. 2, October. 1995, p.27.

[4] Bruce M. Guenin. Thermal Vias-A Packaging Engineer's Best Friend..

[5] Venkat Pothamsetty, Saadat Malik. Smart Grid, Leveraging Intelligent Communications to Transform the Power Infrastructure. Feb. 2009. 2009 Cisco System, Inc.