Properties of Thermal Conductivity on Polyimide/Clay Nanocomposite Foams


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We synthesized polyimide (based on ODA-PMDA) and polyimide foam and polyimide/clay foam that pore size was uniform about 1㎛. We identified that the clay layers are well dispersed in polyimide matrix and achieved exfoliation structure by X-ray diffraction. And we compared thermal conductivity of PI, PI foam, PI/clay foam. Thermal conductivity decreased up to maximum 28 % by introducing both pores and clay layers. Exfoliated structure of clay leads to decrease of thermal conductivity by thermal barrier effect. Also, the presence of clay could considerably reinforce the poor mechanical properties of polyimide by foam because of interfacial interaction between clay layers and polymer matrix. Through the this results, it has shown that this study may provide an effective method to prepare polymer/clay nanocomposite foams having exfoliation structure, and can be used as insulating material having low thermal conductivity.



Edited by:

Mohamed Othman




E. Y. Kim et al., "Properties of Thermal Conductivity on Polyimide/Clay Nanocomposite Foams", Applied Mechanics and Materials, Vols. 229-231, pp. 215-218, 2012

Online since:

November 2012




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