An Appropriate Design in Dimensions of Submount with Extra-Low Thermal Resistance for High Power LED


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A numerical simulation model to obtain the extra-low internal thermal resistance for submount of LED is presented. The 3-D numerical model for calculating thermal resistance is demonstrated on examining the aspect ratio of submount, the contact ratio between chip and submount, and the surrounding condition. According to the analysis by accurate numerical simulations of heat transfer; the appropriate dimensions for different conditions of ambient are determined. The thickness of submount should be over a specially designated value. Besides, a higher contact ratio between heat source and submount, a larger external convective effect, and the heat dissipated from symmetry axis of submount will decrease the spreading thermal resistance.



Edited by:

Wen-Hsiang Hsieh




F. S. Hwu et al., "An Appropriate Design in Dimensions of Submount with Extra-Low Thermal Resistance for High Power LED", Applied Mechanics and Materials, Vols. 284-287, pp. 824-828, 2013

Online since:

January 2013




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