Electroosmotic Flow Pump on Transparent Polyimide Substrate Fabricated Using Hot Embossing

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Improved fabrication processes of an all-polyimide micro electroosmotic flow pump using hot embossing are described. Microchannels in the micropump were fabricated by hot embossing on a transparent polyimide substrate. A silicon micromachined mold was pressed into the transparent polyimide substrate at a temperature of 300 oC to form microchannel patterns on the substrate. The depth and width of the microchannels were 25 μm and 50 μm, respectively. A UV ozone treatment was performed to improve adhesion between the transparent polyimide substrate and film capping layer. This UV ozone treatment enhanced adhesion and resulted in the reduction of the adhesion temperature as low as 100 oC, and nearly no deformation of the microchannels was observed. As a result, the electroosmotic flow pump exhibited the flow rate of 0.7 μl/min when a voltage of 50 V was given between the electrodes separated 20 mm each other.

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Periodical:

Edited by:

Ching Kuo Wang and Jing Guo

Pages:

1356-1359

Citation:

H. Saito et al., "Electroosmotic Flow Pump on Transparent Polyimide Substrate Fabricated Using Hot Embossing", Applied Mechanics and Materials, Vols. 300-301, pp. 1356-1359, 2013

Online since:

February 2013

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$38.00

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