Structural Optimization of MEMS-Based Hydrophones with Perforated Active Membrane

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This paper presents some results of finite element (FE) analysis performed for membrane-type piezoceramic transducer for underwater acoustics applications. We studied the miniaturized sensor with perforated holes in the active PZT membrane, intermediate, and protective plates. In this investigation an influence of the polyimide plate viscous damping, the membranes dimensions and the relative area of the perforated holes on the frequency response of sensitivity was studied for the broadening and flattening the operating frequency band. An optimization of these key parameters using the genetic algorithm working with the device’s FE model was demonstrated.

Info:

Periodical:

Edited by:

Ching Kuo Wang and Jing Guo

Pages:

597-603

DOI:

10.4028/www.scientific.net/AMM.300-301.597

Citation:

S. H. Chang et al., "Structural Optimization of MEMS-Based Hydrophones with Perforated Active Membrane", Applied Mechanics and Materials, Vols. 300-301, pp. 597-603, 2013

Online since:

February 2013

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$35.00

[1] X. Lurton, An Introduction to Underwater Acoustics: Principles and Applications, Springer-Verlag: Germany (2002), p.347.

[2] C. H. Sherman, J. L. Butler, Transducers and Arrays for Underwater Sound, Springer-Verlag: N. -Y. (2007), p.610.

[3] M. Ito, et al., High sensitivity ultrasonic sensor for hydrophone applications using an epitaxial PZT film grown on SrRuO3/Pt/_-Al2O3/Si, Sensors and Actuators A. No. 145-146 (2008), p.278.

DOI: 10.1016/j.sna.2008.01.014

[4] T. Y. Kwon, et al. Fabrication of stabilized piezoelectric thick film for silicon-based MEMS device, Applied physics A: Materials science & processing. Vol. 88, No. 4 (2007), p.627.

DOI: 10.1007/s00339-007-4025-6

[5] P. Muralt, Ferroelectric thin films for micro-sensors and actuators: A review, J. Micromech. Microeng. No. 10 (2000), p.136.

DOI: 10.1088/0960-1317/10/2/307

[6] Z. Wang, et al., Fabrication of piezoelectric MEMS devices-from thin film to bulk PZT wafer, J. of electroceramics. Vol. 24, No. 1 (2010), p.25.

DOI: 10.1007/s10832-008-9454-x

[7] Z. Wang, J. Miao, C. W. Tan, Acoustic transducers with a perforated damping backplate based on PZT/silicon wafer bonding technique, Sensors and Actuators A: Physical. No. 149 (2009), p.277.

DOI: 10.1016/j.sna.2008.11.012

[8] D.F. Bahr, et al., Fracture of piezoelectric MEMS structures. In Proc. on the 11th Int. Conf. on Fracture ICF11, Turin, Italy (2005), p.6.

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