Research on Stress-Strain Field and Fatigue Lifetime of the Hot Stamping Die

Abstract:

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In hot stamping process, the die suffers complex thermal mechanical loads. In this paper, the process model and the materials model were set up. And with the example of U-channel forming, a coupled thermal-mechanical analysis is performed with ABAQUS. According to the simulation result, the stress and strain fields of the die show a great uneven distribution in place and time. And the explanation for the non-uniform was given out in this paper. Finally, the fatigue life of the die was evaluated, and the suggestions were proved for optimizing the fatigue lifetime of hot stamping die.

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Periodical:

Edited by:

Shengyi Li, Yingchun Liu, Rongbo Zhu, Hongguang Li, Wensi Ding

Pages:

1630-1634

DOI:

10.4028/www.scientific.net/AMM.34-35.1630

Citation:

L. Zhang et al., "Research on Stress-Strain Field and Fatigue Lifetime of the Hot Stamping Die", Applied Mechanics and Materials, Vols. 34-35, pp. 1630-1634, 2010

Online since:

October 2010

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$35.00

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