A Three-Dimensional Hydrodynamic Lubrication Model for Chemical-Mechanical Polishing Considering Pad Roughness

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A three-dimensional hydrodynamic lubrication model based on lubrication theory is developed which accounts for pad roughness and slurry flow. The distribution of the slurry film thickness and pressure between the pad and the wafer are predicted using the model. The effects of the pad roughness, the polishing applied load and rotation speed on slurry film thickness and tilt angle are discussed. At last, a CMP experiment is carried out. It is found that the results are proved the three-dimensional model considering pad roughness agrees well with our experimental data. The results improve the previous models so that the CMP process can be better simulated using the model. Furthermore, they are useful in the processing of CMP and the design of the pad roughness.

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Edited by:

Ran Chen

Pages:

1213-1217

Citation:

F. Y. Lou, "A Three-Dimensional Hydrodynamic Lubrication Model for Chemical-Mechanical Polishing Considering Pad Roughness", Applied Mechanics and Materials, Vols. 44-47, pp. 1213-1217, 2011

Online since:

December 2010

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$38.00

[1] Chul-Ho, Sang-Shin Park, Yoomin Ahn: Thin Solid Films 389(2001), pp.254-260.

DOI: https://doi.org/10.1016/s0040-6090(01)00883-5

[2] J.J. Vlassak: Journal of the Mechanics and Physics of Solids, Vol. 52 (2004), pp.847-873.

[3] Shizhu Wen: Tribology Principal ( Tsinghua Univerisity Press, Beijing, 2002) in Chinese.

[4] Long Zhou, MinliBai: Feijian Customer Conference, 2006, pp.342-354, in Chinese.

[5] Xiaomin Ye: PhD dissertation, Huazhong University of Science and Technology, March 2004, pp.18-23, in Chinese.

[6] Parir N and Cheng H S: ASME, Journal of Lubrication Technology, Vol. 101, No. 4, 1979, pp.220-230.

[7] J.L. Yuan F.Y. Lou Z.Z. Zhou et al.: Key Engineering Materials, Vols. 315-316(2006), pp.279-283.

[8] Feiyan Lou, Pin Zhao, Xiaofeng Zhen et al.: New Technology &New Process, Vol. 4 (2008) pp.53-57, in Chinese.