Preparation of Silica-Based Alkaline Slurry and its Application on Chemical Mechanical Polishing of Hard Disk Substrates


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Chemical mechanical polishing (CMP) is the effective technology which obtains high accuracy surface of hard disk substrate with nickel-phosphorus (Ni-P) coating. The slurry is significant factor in hard disk substrate CMP. Colloidal silica-based alkaline slurry was prepared based on negative pressure vortex method. The effects of slurry parameters such as abrasive concentration, organic alkali concentration and oxidant concentration on material removal rate and surface characteristics were investigated. The experimental result indicated that the abrasive concentration was 20wt%, the slurry pH value was 11.2, the oxidant concentration was 15ml/L, improved surface roughness and polishing efficiency of hard disk substrates, a smooth surface was obtained and micro scratches could hardly be observed.



Edited by:

Ran Chen




S. L. Wang et al., "Preparation of Silica-Based Alkaline Slurry and its Application on Chemical Mechanical Polishing of Hard Disk Substrates", Applied Mechanics and Materials, Vols. 44-47, pp. 3067-3071, 2011

Online since:

December 2010




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