Dynamical Simulation about Buffer Packaging of Computer

Abstract:

Article Preview

A host computer packaging cushion is designed, including deflection, buffering capacity, creep checking. Then g a three-dimensional model of the host buffer packaging systems is established Simulation of the system, including static analysis, modal analysis, harmonic analysis and transient dynamic analysis. Finally, the physical system is used to do the sine frequency, fixed-frequency sinusoidal vibration test. the vulnerability of the buffer package sinusoidal frequency calculate by the computer modal analysis larger than the resonance frequency of the measured test values This is due to host the actual shell of the computer by each side made of thin steel plate riveting, and list them in the computer simulation as a whole in the shell, so that the overall stiffness of the system become larger, so that the analysis of the inherent frequency than the actual value. Transient dynamic analysis of the computer meets the fixed-frequency sinusoidal test results,which are all happened in the prophase of vibration in the balance position. This vibration last a period causing fatigue, so that the acceleration package increases slowly and the product damage.

Info:

Periodical:

Edited by:

Qi Luo

Pages:

1711-1724

DOI:

10.4028/www.scientific.net/AMM.55-57.1711

Citation:

G. Q. Zhang et al., "Dynamical Simulation about Buffer Packaging of Computer ", Applied Mechanics and Materials, Vols. 55-57, pp. 1711-1724, 2011

Online since:

May 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.