Experimental Research on Phase-Change Cooling for High-Power Chip

Abstract:

Phase change cooling technology is based on the boiling of refrigerating medium to absorb the heat generated by the electronic chip. It provides higher heat flux dissipation, reduces the refrigerating medium flux and consumes a lower pumping power, compared with single-phase liquid cooling. It also has good temperature uniformity and higher working temperature, which is ideal for energy reuse. Experimental system was designed for phase change cooling of R123 to analyze the basic conditions required for boiling vaporization. The chip temperature was 70 °C or less when the heat flux was 100 W·cm^-2, with the 0.6 mm rectangular micro-channel evaporator. Experiments were conducted to analyze the effects of heat flux, channel dimension, throttling action on the heat transfer effect.

• Periodical: Applied Mechanics and Materials (Volume 628)
• Pages: 306-310
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.628.306
• Online since: September 2014
• Authors: Long Sheng Wu, Xu Zhang, Cheng Jian Wang, Zhen Long Wang*
• Keywords: High Performance Computer, High-Power Chip, Micro-Channel, Phase Change Cooling

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