Performances of Modified Urea-Formaldehyde Resins for Bonding Plywood

Abstract:

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Urea-formaldehyde resin was modified by a modifier with different synthetic processes labelled as UFM1, UFM2, and UFM3 respectively. As a comparison, normal UF resin with a F/U molar ratio of 1.1 labelled as UF0 was synthesized. The thermal behavior of modified urea-formaldehyde resins was studied by TG-DTA techniques, and the properties of plywood bonded with the UFM resins were investigated. The conclusions were as follows: (1) the modifier used in this study could significantly reduce the free formaldehyde content of urea-formaldehyde resin and the formaldehyde emission of plywood; (2) The exothermic peak temperatures of DTA curve were 129.37, 125.05, 120.98, and 116.11 °C for UF0, UFM1, UFM2, and UFM3 respectively. (3) The plywood manufactured with UFM2 and UFM3 resins have high bonding strength (1.28MPa and 1.59MPa) and low formaldehyde emission value (E1 grade).

Info:

Periodical:

Edited by:

Dongye Sun, Wen-Pei Sung and Ran Chen

Pages:

3170-3173

DOI:

10.4028/www.scientific.net/AMM.71-78.3170

Citation:

J. Z. Zhang et al., "Performances of Modified Urea-Formaldehyde Resins for Bonding Plywood", Applied Mechanics and Materials, Vols. 71-78, pp. 3170-3173, 2011

Online since:

July 2011

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$35.00

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