Experimental Study on Thermal Contact Resistance between Cuprum and Aluminum

Abstract:

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Cuprum and aluminium are common thermal conductive materials in daily life. Thermal contact resistance is quite complex and depends on many parameters including surface characteristics of the interfacial region, temperature and contact pressure. In this paper, experimental equipment is invented and different working conditions are designed for studying the relationship of thermal contact resistance and temperature between cuprum and aluminium. Experimental results showed that thermal contact resistance will decrease obviously in a period of temperature, and after that period, thermal contact resistance will almost be a constant. These results would be a certain benefit to practical application of cuprum and aluminum.

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Periodical:

Edited by:

Linli Xu, Wenya Tian and Elwin Mao

Pages:

1340-1344

DOI:

10.4028/www.scientific.net/AMM.80-81.1340

Citation:

S. Ji et al., "Experimental Study on Thermal Contact Resistance between Cuprum and Aluminum", Applied Mechanics and Materials, Vols. 80-81, pp. 1340-1344, 2011

Online since:

July 2011

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Price:

$35.00

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