Paper Title:
Structure Design for Heat Sink Based on Thermal Analysis
  Abstract

Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.

  Info
Periodical
Chapter
Chapter 6: Functional Materials
Edited by
Linli Xu, Wenya Tian and Elwin Mao
Pages
767-773
DOI
10.4028/www.scientific.net/AMM.80-81.767
Citation
H. G. Sun, Y. Zhou, "Structure Design for Heat Sink Based on Thermal Analysis", Applied Mechanics and Materials, Vols. 80-81, pp. 767-773, 2011
Online since
July 2011
Export
Price
$35.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Xiao Wei Liu, Rong Yan Chuai, You Feng Zhang, Q.F. Tao
Abstract:The paper presents a micro-fluidics cooling system which is designed on a silicon substrate including a micro-pump, two temperature sensors,...
490
Authors: Dong Mei Zhu, Guo Yong Liu, Shao Jun Zhang, Qi Shen Zhu, Jie Yang
Product Life Cycle Design
Abstract:For new copper online cooling equipment, the heat transfer coefficients of impinging jet and flow cooling on the surface of copper plate are...
692
Authors: Vithyacharan Retnasamy, Zaliman Sauli, Hussin Kamarudin, Muammar Mohamad Isa, Gan Meng Kuan
Chapter 5: Fluid Mechanics, Heat Transfer
Abstract:In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through...
332