Surface Morphology and Dielectric Properties of KNN/PI Films

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Polyimide (PI) films filled with K0.5Na0.5NbO3 particles at different weight 0wt%,5wt%,10wt%,15wt% and 20wt% had been prepared by in-situ dispersion polymerization process in this article. then we measured morphology and dielectric properties. when the mass fraction of KNN reach 20%, its dielectric constant achieve 4.9(100Hz) with the dielectric loss tangent value is less than 0.025 (100 Hz).it Shows the good insulating properties.

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Edited by:

Z.S. Liu, L.P. Xu, X.D. Liang, Z.H. Wang and H.M. Zhang

Pages:

240-243

Citation:

J. Q. Lin et al., "Surface Morphology and Dielectric Properties of KNN/PI Films", Advanced Materials Research, Vol. 1015, pp. 240-243, 2014

Online since:

August 2014

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$38.00

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[1] Park S J, Lee E J, Kim B J. A study of atmospheric-pressure CHF< sub> 3/Ar plasma treatment on dielectric characteristics of polyimide films[J]. Journal of colloid and interface science, 2008, 319(1): 365-369.

DOI: https://doi.org/10.1016/j.jcis.2007.08.003

[2] Liaw D J, Wang K L, Huang Y C, et al. Advanced polyimide materials: syntheses, physical properties and applications[J]. Progress in Polymer Science, 2012, 37(7): 907-974.

[3] Maguire J A, Zhu Y, Takagaki M. Boron and gadolinium neutron capture therapy for cancer treatment[M]. World Scientific, (2012).

[4] Yao J, Xiong C, Dong L, et al. Enhancement of dielectric constant and piezoelectric coefficient of ceramic–polymer composites by interface chelation[J]. Journal of materials chemistry, 2009, 19(18): 2817-2821.

DOI: https://doi.org/10.1039/b819910h

[5] Arbatti M, Shan X, Cheng Z Y. Ceramic–polymer composites with high dielectric constant[J]. Advanced Materials, 2007, 19(10): 1369-1372.

DOI: https://doi.org/10.1002/adma.200601996

[6] Ziari Z, Sahli S, Bellel A, et al. Simulation of surface potential decay of corona char ged polyimide[J]. Dielectrics and Electrical Insulation, IEEE Transactions on, 2011, 18(5): 1408-1415.

DOI: https://doi.org/10.1109/tdei.2011.6032809