Design and Solder Process Optimization in MID Technology for High Power Applications


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Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. The MID technology is yet to be explored for high temperature applications in automotive or consumer lighting. One of the hindering factors for such implementation in the serial production and time to market is the improper electronic and thermal packaging of the light emitting diodes (LEDs) on the MID substrates. This paper addresses the optimization of mold design, surface metallization and soldering process for the effective thermal management of the high-power LED systems. By using a simulation model, the thermal distribution and the resultant decrease in temperatures for varying forward electrical currents in high-power LEDs by design optimization is demonstrated. In addition, the optimization of solder process with respect to solder profile in context of vacuum vapor-phase soldering for void-free solder connections is discussed.



Edited by:

Jörg Franke, Thomas Kuhn, Albert Birkicht and Andreas Pojtinger




A. Syed-Khaja and J. Franke, "Design and Solder Process Optimization in MID Technology for High Power Applications", Advanced Materials Research, Vol. 1038, pp. 107-112, 2014

Online since:

September 2014




* - Corresponding Author

[1] R. Tummala, Fundamental of Microsystems Packaging, The McGraw-Hill, (2000).

[2] T. Leneke, S. Majcherek, S. Hirsch, M. -P. Schmidt, B. Schmidt, A microfluidic interposer based on three dimensional molded substrate technology, in International Conference on Electronics Packaging (ICEP), (2014).


[3] J. Franke, Räumliche elektronische Baugruppen (3D-MID): Werkstoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungsträger. München, Carl Hanser Verlag, (2013).


[4] C. Goth, M. Müller, J. Franke, K. Feldmann, Markt- und Technologieanalyse für räumliche elektronische Schaltungsträger (MID), in Internationales Forum Mechatronik, (2011).

[5] Datasheet: LITE-ON Technology Corp. Part No. LOPL-E001B Data-sheet, (2009).

[6] F. Incropera, D. DeWitt, Fundamentals of Heat and Mass Transfer, Fourth Edition. New York: John Wiley & Sons, (1996).

[7] W.H. McAdams, Heat Transmission, 3rd edition, Chapter 7, Natural convection.

[8] D.R. Pitts, L.E. Sissom, Schaum's outline of Heat Transfer, 2nd edition, (1997).

[9] A. Syed Khaja, C. Kaestle, A. Reinhardt, J. Franke, Optimized Thin-Film Diffusion Soldering for Power-Electronics Production, in Proceedings 36th ISSE, Alba lulia, (2013).