Hot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID

Abstract:

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The adhesion test of metallic structures on MID (Molded Interconnect Devices) parts is an unsolved issue. So far no method really works reliably. The test methods which are conventionally used are the pull-off test and the shear-test. Both show large standard deviation and the reproducibility is not assured. Nordson DAGE has introduced the new micro-material testing system 4000Plus. This device enables a new test method for the determination of the adhesion strength of MID structures using the hot pin pull (hot bump pull) method. Copper pins (tinned or untinned) are heated up with a user defined temperature profile, soldered to a metallized structure on the MID and then removed vertically upward, while the force is recorded. In this contribution investigations with this new test method are presented.

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Periodical:

Edited by:

Jörg Franke, Thomas Kuhn, Albert Birkicht and Andreas Pojtinger

Pages:

115-120

Citation:

C. Goth et al., "Hot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID", Advanced Materials Research, Vol. 1038, pp. 115-120, 2014

Online since:

September 2014

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$41.00

* - Corresponding Author

[1] J. Franke (Publ. ): Three-Dimensional Molded Interconnected Devices (3D - MID) Materials, Manufacturing, Assembly, and Application for Injection Molded Circuit Carriers. Carl Hanser Verlag, München (2014).

DOI: https://doi.org/10.3139/9781569905524.fm

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[3] DIN EN ISO 4624: Deutsches Institut für Normung e. V. (DIN): Beschichtungsstoffe – Abreißversuch zur Beurteilung der Haftfestigkeit. Berlin: Beuth-Verlag, (2003).

[4] N. N.: IMDAKT – Innovative Mikrodrehgeber für die Automatisierungs- und Kraftfahr-zeugtechnik. Abschlussbericht des BMBF-Vorhabens V2386, (2006).

[5] H. Willeck: Aufbau und Charakterisierung eines neuen Messgeräts zur direkten Bestimmung der Haftfestigkeit von strukturierten Metallschichten. Dr. Hut Verlag, Stuttgart (2009).

[6] K. Zeh: Selection and Qualification of a Test Method for Determining Adhesion of MID Metallization in the LDS Technology, 10th International Congress MID, Fuerth (2012).