Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

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—Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.

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Periodical:

Edited by:

Katsuyuki Kida

Pages:

467-470

DOI:

10.4028/www.scientific.net/AMR.1082.467

Citation:

R. Saini et al., "Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA", Advanced Materials Research, Vol. 1082, pp. 467-470, 2015

Online since:

December 2014

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$35.00

* - Corresponding Author

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