Advances in Abrasive Technology XVIII

Volume 1136

doi: 10.4028/www.scientific.net/AMR.1136

Info:

Advances in Abrasive Technology XVIII
ISBN-13:
978-3-03835-651-6
Authors / Editors:
Hon-Zong Choi, Haedo Jeong, Xiping Xu and Hideki Aoyama
Pages:
718
Year:
2016
Edition:
softcover

Description:

Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.
The 114 papers are grouped as follows:
Chapter 1: Grinding
Chapter 2: Abrasive Jet Machining
Chapter 3: Advanced Cutting Technology
Chapter 4: Processing of Brittle Materials
Chapter 5: Chemical Mechanical Polishing, Processing of Semiconductor Wafer
Chapter 6: Electrical Discharge Machining, Ultrasonic and Beam Machining
Chapter 7: Finishing, Lapping and Polishing
Chapter 8: Surface and Subsurface Integrity and Materials Characterization
Chapter 9: In-Process Measurement and Monitoring, Metrology
Chapter 10: Machine Tools and Systems, Tooling Processing

Keywords: Abrasive Machining, Advanced Cutting Technology, Grinding, Lapping, Polishing, Finishing, Tribology, Surface Integrity

Review from Ringgold Inc., ProtoView: Edited by Choi, Jeong, Xu, and Aoyama, this book is comprised of peer-reviewed papers selected from research presented at the eighteenth International Symposium on Advances in Abrasive Technology, held in October of 215 in Korea. The editors have organized the contributions that make up the main body of the text in ten chapters devoted to grinding, abrasive jet machining, advanced cutting technology, the processing of brittle materials, and other related categories according to use. Individual selections are focused on drilling of microholes using diamond grinding tools, experimental research on flexible polishing by compound diamond powder, and many other topics

Ringgold Subjects:

β€” Materials science
β€” Mechanical engineering

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