Optimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface Method

Abstract:

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In TFT-LCD manufacturing process, the ACF is an essential material. To make the driving circuit conductive, the ACF attach process is used in bonding process. Since the total manufacturing cost becomes lower year by year, the ACF material occupies a great deal of manufacturing cost. The boding technology has been changed from the conventional long bar type into short bar type to save the material usage. The parameter setting of the short bar type machine was not initially optimized. The NG rate of short bar type ACF attach process is higher as compared to the long bar type. The rework cost and material cost may increase in the short bar type process. Therefore, the parameter optimization for the associated short bar type ACF attach process becomes an essential problem. The response surface method is adopted to model the problem. The yield rate is selected as objective function for study. In the analysis of response surface method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are selected three key factors for discussion. Results reveal that the yield rate can be improved up to 99.35%, which is very helpful to improve the manufacturing process.

Info:

Periodical:

Advanced Materials Research (Volumes 126-128)

Edited by:

Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso

Pages:

208-213

DOI:

10.4028/www.scientific.net/AMR.126-128.208

Citation:

J. L. Kuo and C. H. Hsieh, "Optimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface Method", Advanced Materials Research, Vols. 126-128, pp. 208-213, 2010

Online since:

August 2010

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Price:

$35.00

[1] Savolainen P. Display Driver Packaging: ACF Reaching the Limits?" IEEE 9th Int, l Symposium on Advanced Packaging Materials, pp.7-10, (2004).

DOI: 10.1109/isapm.2004.1287980

[2] Yin, C. Y., Lu, H., Bailey, C., and Chan, Y.C., 2004, Effects of Reflow Process on the Reliability of Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives, Internattional IEEE Conference on Asian Green Electronics, pp.240-245.

DOI: 10.1109/agec.2004.1290912

[3] Chin, M., Iyer, K. A., and Hu, S. J., 2004, Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies, IEEE Trans, Comp. Packag. Technol, 27, pp.317-326.

DOI: 10.1109/tcapt.2004.828565

[4] Hu, K. X., Yeh, C. P., and Wyatt, K. W., 1997, Electro-thermo-mechanical responses of conductive adhesive materials, IEEE Trans, Comp., Packag., Manufact. Technol. A, 20, pp.470-477.

DOI: 10.1109/95.650937

[5] Fan, S. H., and Chan, Y. C., 2002, Effect of Misalignment on Electrical Characteristics of ACF Joints for Flip Chip on Flex applications, Microelectronics Reliability , 42, pp.1081-1090.

DOI: 10.1016/s0026-2714(02)00069-0

[6] Yim, M. J., and Paik, K. W., Design and Understanding of Anisotropic Conductive Films for LCD Packaging, IEEE Trans, Comp. Packag. Technol -Part A, Vol. 21, No. 2, pp.226-234, (1998).

DOI: 10.1109/95.705468

[7] Cheng, H.C., Chen, W.H. and Chung, I-C, Integration of Simulation and Response Surface Method for Thermal Design of Multichip Modules, IEEE Trans, Comp. Packag. Technol, Vol. 27 No. 2, June, p.359~372, (2004).

DOI: 10.1109/tcapt.2004.828560

[8] Cheng, H.C., Ho, C.L., Chen, W.C., and Yang, S.S., 2005, A Study of Process-induced Deformations of Anisotropic Conductive Film Assembly, To be applied in IEEE Trans, Comp. Packag. Technol, (2006).

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