New Development of Contact Probe and Methodology

Abstract:

Article Preview

We present a new type of wafer probe card with resin film consisting of two beams. Resin film is embedded on both sides of the probe beam, having a thickness of 4 [μm] and made from polyimide. This proposed probe enables compliant structures with large overdrive to ensure high durability of the structure and controllable scrub motion to assure cleaning process. In this study, Matrix method is introduced for theoretical studies of the probe structure and commercial finite element code is used. Electrical contact resistance is determined by theoretical studies based on Holm's theory and experimentally by our measurement instrumentation respectively. The structure is proven theoretically to get appropriate scrub motion when it undergoes a large overdrive with preferable exhibited contact force. Moreover, all of these mechanical characteristics can be varied to know the values of the character of probes. The methodology having one of the most preferable characters of the contact-probe had been achieved.

Info:

Periodical:

Advanced Materials Research (Volumes 126-128)

Edited by:

Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso

Pages:

726-731

Citation:

G. Kimoto et al., "New Development of Contact Probe and Methodology", Advanced Materials Research, Vols. 126-128, pp. 726-731, 2010

Online since:

August 2010

Export:

Price:

$38.00

[1] Y. Zhang, D. Worsham, D. Morrow, R.B. Marcus: A new MEMS wafer probe card, Proceedings of the 10th International Workshop on Micro Electro Mechanical Systems, Nagoya, Japan (1997), pp.135-399.

DOI: https://doi.org/10.1109/memsys.1997.581868

[2] S. Kawamura, K. Kataoka, T. Itoh, and T. Suga, Design and fabrication of an electrostatically actuated MEMS probe card, The 12th International Conference on Solid State Sensors, Actuators and Microsystems, Boston (2003), pp.1522-1525.

DOI: https://doi.org/10.1109/sensor.2003.1217067

[3] T. Ito, R. Sawada, E. Higurashi: Micro IC probe for LSI testing, 12th IEEE International Conference on Micro Electro Mechanical System, Orland (1999), pp.263-266.

DOI: https://doi.org/10.1109/memsys.1999.746830

[4] T. Ito, R. Sawada, E. Higurashi: fabrication of micro IC probe for LSI testing, Sensors an Actuators A 80 (2000), pp.126-131.

DOI: https://doi.org/10.1016/s0924-4247(99)00257-5

[5] T. Kimura, S. Tajima, T. Sakamoto, M. Tsuboi, T. Ishida, and T. Hattori: A Novel MEMS probe for LSI testing, IEEE (2007), pp.454-459.

DOI: https://doi.org/10.1109/mhs.2007.4420898

[6] K. Kataoka, S. Kawamura, T. Itoh, K. Ishikawa, H. Honma, and T. Suga, Electroplating Ni mic-cantilevers for low contact-force IC probing, Sensors and Actuators A 103 (2003), pp.116-121.

DOI: https://doi.org/10.1016/s0924-4247(02)00312-6

[7] T. Ishida, T. Sakamoto, T. Kimura, S. Tajima, T. Matsumoto, Y. Makino, K. Uenishi, and T. Sato, Development of MEMS Probe Module-Study on Contact with Al Electrode, Preceeding 14th Symposium on Micro-joining and Assembly Technology in Electronics, Yokohama, Japan (2008).

[8] K. Kataoka, T. Itoh, K. Okumura, and T. Suga: Low contact force probing on copper electrodes, International Test Conference, IEEE (2002), pp.424-429.

DOI: https://doi.org/10.1109/test.2002.1041791

[9] T. Haga, K. Okada, J. Yorita, K. Nakamae, Y. Hirata, and H. Takada: Development of Micro Contact Probe, SEI technical review, no. 55, (2003), pp.66-70.

[10] R. Holm, Electric Contacts, Theory and Application, (4th ed. ) Berlin/New York: Springer (1967).