The Reliability Analysis of a Vacuum Forming Mold for IC Packing Bag

Abstract:

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This article is pointed to the reliability analysis of the vacuum forming mold for plastic carrier tape. The reliability analysis of the vacuum forming mold was decided by the dimension specification of the plastic carrier tape. The reliability design of the vacuum forming mold was preceded according to the reliability requirement. After detail design of the parts which would be manufactured and assembled. The accuracy and performance of the mold had been tested subsequently. The reliability of the mold was conducted by the accuracy of the plastic carrier tape. Through series of inspections and analysis, all the dimension accuracy of the plastic carrier tape met the specification, and vacuum forming mold’s reliability level confirms to design requirement.

Info:

Periodical:

Edited by:

Dunwen Zuo, Hun Guo, Hongli Xu, Chun Su, Chunjie Liu and Weidong Jin

Pages:

114-117

DOI:

10.4028/www.scientific.net/AMR.136.114

Citation:

W. S. Lin "The Reliability Analysis of a Vacuum Forming Mold for IC Packing Bag", Advanced Materials Research, Vol. 136, pp. 114-117, 2010

Online since:

October 2010

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$35.00

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