Production of Silver Coated Copper Powders by Electroless Plating Method

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Copper powders with very dense, uniform silver coating layer were prepared by electroless plating method in aqueous system at room temperature. Silver-copper composite powders were obtained by strictly controlling the activation and complexing process variables such as NH4OH/(NH4)2SO4 molar ratio, tartrate concentration, and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis are key factors to obtain high quality Ag-Cu composite powders.

Info:

Periodical:

Advanced Materials Research (Volumes 15-17)

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran

Pages:

570-574

Citation:

H. T. Hai et al., "Production of Silver Coated Copper Powders by Electroless Plating Method", Advanced Materials Research, Vols. 15-17, pp. 570-574, 2007

Online since:

February 2006

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$38.00

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[6] K.L. Yeung, S. Christiansen, A. Varma, Journal of Membrane Science 159(1999), pp.107-122. Fig. 5 Characteristics of composite powder along with plating time 024681012.

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[1] 0 Coating time (minute) Specific surface area (m 2 /g) -18 -12 -6 0 6 12 18 24 Silver weight percentage (%) 20 40 60 80 100 Intensity (a. u).

[1] 19wt% Ag.

[2] 39wt% Ag.

[4] 79wt% Ag.

[6] 04wt% Ag Ag Cu 2 Deg. 2min 5min 8min 12min.