Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization

Abstract:

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Synthesize a thermoplastic polyimide (TP-PI) by 4, 4’-Bisphenol A dianhydride (BPADA) and 4, 4’-diaminodiphenyl ether(ODA) to toughen thermosetting polyimide(TS-PI) of BPADA and 3-aminophenylacetylene (APA) system. Improve the toughness of matrix resin by control morphology of blends. The results show that the system has been phase separation, TP-PI as a continuous phase, blends is part miscibility or immiscibility. Compose materials anysis show that the adhesion of resin and fiber have been improved, toughness of resin-based composite materials has been improved at the same time without sacrificing original thermal properties and modulus.

Info:

Periodical:

Advanced Materials Research (Volumes 150-151)

Edited by:

Jinglong Bu, Zhengyi Jiang and Sihai Jiao

Pages:

1330-1335

DOI:

10.4028/www.scientific.net/AMR.150-151.1330

Citation:

D. M. Wang et al., "Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization", Advanced Materials Research, Vols. 150-151, pp. 1330-1335, 2011

Online since:

October 2010

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Price:

$35.00

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