Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization
Synthesize a thermoplastic polyimide (TP-PI) by 4, 4’-Bisphenol A dianhydride (BPADA) and 4, 4’-diaminodiphenyl ether(ODA) to toughen thermosetting polyimide(TS-PI) of BPADA and 3-aminophenylacetylene (APA) system. Improve the toughness of matrix resin by control morphology of blends. The results show that the system has been phase separation, TP-PI as a continuous phase, blends is part miscibility or immiscibility. Compose materials anysis show that the adhesion of resin and fiber have been improved, toughness of resin-based composite materials has been improved at the same time without sacrificing original thermal properties and modulus.
Jinglong Bu, Zhengyi Jiang and Sihai Jiao
D. M. Wang et al., "Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization", Advanced Materials Research, Vols. 150-151, pp. 1330-1335, 2011