Copper Plating on SUS 304 Plate from Acid Bath


Article Preview

SUS 304 used. A passive film on surface was needed to remove with anodic electrolytic degreasing in 3.0 mol/dm3 H2SO4 at 298 K. Cu film was electroplated 20 mA/cm2 in 0.5 mol/dm3 CuSO4 and 2 mol /dm3 H2SO4. Current efficiency increased when plating carried in sonication of 28 kHz after plating in stationary state. Particles were destroyed and size became smaller with shockwave pressure. Particles were pressed in pinholes, defects, etc. Surface that was obtained at 28 kHz was smooth and dense compared with other agitation states.



Advanced Materials Research (Volumes 154-155)

Edited by:

Zhengyi Jiang, Xianghua Liu and Jinglong Bu




A. Chiba and Y. Doi, "Copper Plating on SUS 304 Plate from Acid Bath", Advanced Materials Research, Vols. 154-155, pp. 1008-1011, 2011

Online since:

October 2010




[1] A. Chiba and Y. Sasaki, Copper plating on aluminum plate from cupric-EDTA Bath, Proceedings of ICAMP-5, (2008) F082.

[2] F. Delaunois and P. Lienard, Heat treatments for electroless nickel-boron on aluminum alloys, Surface and Coating Technology, 160 (2002) pp.239-248.


[3] M. Kanungo, V. Chakravarty, K. G. Mishra and S. C. Das, Influence of perchloric acid on the kinetics of immersion plating of copper onto aluminum, Hydrometallurgy, 61 (2001) pp.1-11.


[4] Y. -J Hu, L. Xiong and J-L Meng, Electron microscopic study on interfacial characterization of electroless Ni-W-P plating aluminium alloy, Applied Surface Science, 253 (2007), pp.5029-5034.


[5] M. Kanungo, K. G. Mishra and S. C. Das, Composit plating of hard chromium on aluminum substrate, Surface and Coatings Technology, 191(2005) pp.324-329.

[6] M. Kanungo, K. G. Mishra and S. C. Das, Study on morphology of copper deposited onto aluminium by immersion plating from an oxalate bath containing perchloric acid, Minerals Engineering, 16(2003) pp.1383-1386.


[7] Y. Zuo, J. Tang, C. Fan, Y. Tang, J. Xiong, An electroless plating film of palladium on 304 stainless steel and its excellent corrosion resistance, Thin Solid Films, 516, (2008) pp.7565-7570.


[8] J. Tang, Y. Zuo, Study on corrosion resistance of palladium on 316L stainless steel by electroplating and electroless plating, Corrosion Science, 50 (2008) pp.2873-2878.


[9] L-Q Zhu, M-W Li, H. Wang, Electrochemical behavior of oxide films of stainless steel in 40 kHz sonicated sulphate electrolytes, Chinese Journal of Aeronautics, 20 (2007) pp.148-152.


[10] S.S. Mahmoud, Electroless deposition of nickel and copper on titanium substrate: Characterization and application, Journal of Alloys and Compounds, 472 (2009) pp.595-601.


Fetching data from Crossref.
This may take some time to load.