An Experimental Study on the Impact on Vari-Speed Milling to the Capacity Machine Tool

Xue, Xiao Qiang; He, Ning; Li, Liang; Zhao, Wei; Wang, Qi

doi:10.4028/www.scientific.net/AMR.188.648

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HomeAdvanced Materials ResearchHigh Speed MachiningAn Experimental Study on the Impact on Vari-Speed...

An Experimental Study on the Impact on Vari-Speed Milling to the Capacity Machine Tool

Abstract:

The axial limit cutting depth(LCD) of constant speed were studied, and the stability lobes were gotten by expriments and simulation. The vari-speed milling selected various parameters was investigated by expriments,also.The experimental results show that varying speed milling approach improves the limit cutting depth on proper time and prope parameters selection. According to the comparative analysis of the exprimental results of constant speed and vari-speed milling, it was obtained whether the varying speed milling approach was to be chosen and how to select proper parameters, should be reference to the stability lobes of constant speed.

Info:

Periodical:

Advanced Materials Research (Volume 188)

Main Theme:

High Speed Machining

Edited by:

Chengyong Wang, Ning He, Ming Chen and Chuanzhen Huang

Pages:

648-651

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.188.648

Citation:

X. Q. Xue et al., "An Experimental Study on the Impact on Vari-Speed Milling to the Capacity Machine Tool", Advanced Materials Research, Vol. 188, pp. 648-651, 2011

Online since:

March 2011

Authors:

Xiao Qiang Xue, Ning He, Liang Li, Wei Zhao, Qi Wang

Keywords:

Chatter Suppressing, Limit Cutting Depth, Vari-Speed Milling

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$38.00

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References

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Paper TitlePages

Improvement on Yield of Anisotropic Conductive Film Attach Process in TFT-LCD Module Using Taguchi Method

Authors: Jian Long Kuo, Kai Lun Chao, Chung Hao Hsieh

Abstract: Anisotropic Conductive Film (ACF) is one of the important materials in LCM (Liquid Crystal Module) process, it is used in bonding process to make the driving circuit conductive. Because the price of TFT-LCD is much lower than before in recent years, the ACF cost has higher ratio in manufacture cost. The conventional long bar ACF attach unit is changed to short bar ACF attach unit in new bonding equipment. However, the new type machine was not optimized in process and mechanical design. Therefore, the failure rate of ACF attach process is much higher than the one of conventional method. This wastes the material and rework cost is also invisible. How to make the manufacturing cost down effectively and promote the product quality will be the important concern to keep the product competition. Therefore, the Taguchi method is used to analyze the problem. The ACF attach yield rate is selected to be objective function for optimization. By the optimization of quality characteristic using Taguchi method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are studied to optimize the design parameters.

717

Optimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface Method

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Abstract: In TFT-LCD manufacturing process, the ACF is an essential material. To make the driving circuit conductive, the ACF attach process is used in bonding process. Since the total manufacturing cost becomes lower year by year, the ACF material occupies a great deal of manufacturing cost. The boding technology has been changed from the conventional long bar type into short bar type to save the material usage. The parameter setting of the short bar type machine was not initially optimized. The NG rate of short bar type ACF attach process is higher as compared to the long bar type. The rework cost and material cost may increase in the short bar type process. Therefore, the parameter optimization for the associated short bar type ACF attach process becomes an essential problem. The response surface method is adopted to model the problem. The yield rate is selected as objective function for study. In the analysis of response surface method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are selected three key factors for discussion. Results reveal that the yield rate can be improved up to 99.35%, which is very helpful to improve the manufacturing process.

208

Simulation Modeling and Analysis of TFT-LCD Color Filter Fabrication Plants

Authors: James C. Chen, Po Tsang B. Huang, Hui Yu Peng, Ming Chien Hung, Chih Cheng Chen, Tzu Wei Peng, Shih Wu Li, Shiuan Ming Huang

Abstract: An AutoMod simulation model was constructed for real-world 4.5th-generation (4.5G) Thin Film Transistor - Liquid Crystal Display (TFT-LCD) Color Filter (CF) fabrication plants in this study. The characteristics and data of customer orders, production facility, material handling tools, and warehouse (also called stocker) were collected from real plants. Based on these, a simulation model was developed and validated. As the simulation model was complex and had different parameters representing the operation details in the plants, it is of interest to justify the effects of these parameters to the key performance indicators such as system throughput and equipment utilization. Using fishbone analysis, sensitivity analysis and experimental design, a series of simulation experiments were conducted and the resulting simulation model was representative to the CF plants. On the basis of the simulation model with 3-dimension animation, decision makers can conduct what-if analysis for the evaluation of production control policies such as in-process capacity and tact time without disturbing the operations in the real plant. Better alternatives leading to higher system throughput can be identified in system simulation before its real implementation in the fab.

119

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488

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