Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder


Article Preview

The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt﹪.



Advanced Materials Research (Volumes 189-193)

Edited by:

Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang






C. H. Du et al., "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder", Advanced Materials Research, Vols. 189-193, pp. 3326-3330, 2011

Online since:

February 2011




[1] C.H. Du, F. Chen and F.X. Huang: Micro-connection Technique and Materals. (China Machine Press, Beijing 2008).

[2] J.M. Song, G.F. Lan and T.S. Lui: Scripta Materialia Vol. 48 (2003), pp.1047-1051.

[3] C.M. Wu, D.Q. Yu and L. Wang: Journal of Electronic Materials Vol. 31 (2002), pp.921-927.

[4] D.Q. Yu, J. Zhao and L. Wang: The Chinese Journal of Nonferrous Metals Vol. 13 (2003), pp.1001-1004.

[5] C.H. Du, F. Chen, China Patent, ZL200310111101. 8, (2006).

[6] W.Y. Wu, X.M. Qiu, S.Q. Yin, et al: The Chinese Journal of Nonferrous Metals Vol. 16 (2006), pp.159-163.

[7] J. Zhou, Y.S. Sun and F. Xue: Acta Metallurgical Sinica Vol. 41 (2005), pp.743-749.

[8] X.Q. Fu, J. Zhou, Y.S. Sun, et al: Journal of Southeast University (Natural Science Edition) Vol. 36 (2006), pp.832-835.

[9] J.M. Song, T.S. Lui and Y.L. Chang: Journal of Alloys and Compounds Vol. 403 (2005), pp.191-196.

[10] R.A. Islama, B.Y. Wu and M.O. Alam: Journal of Alloys and Compounds Vol. 392 (2005), pp.149-158.

In order to see related information, you need to Login.