Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder
The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt﹪.
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
C. H. Du et al., "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder", Advanced Materials Research, Vols. 189-193, pp. 3326-3330, 2011