Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder

Abstract:

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The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt﹪.

Info:

Periodical:

Advanced Materials Research (Volumes 189-193)

Edited by:

Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang

Pages:

3326-3330

DOI:

10.4028/www.scientific.net/AMR.189-193.3326

Citation:

C. H. Du et al., "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder", Advanced Materials Research, Vols. 189-193, pp. 3326-3330, 2011

Online since:

February 2011

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Price:

$35.00

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