Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films

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Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect applications. In this paper, a new kind of polymer-based conductive particle used in anisotropic conductive adhesive films (ACFs) is prepared. The preparation of the single scattered polystyrene spheres with the particle size of 3 microns around and the less than 5% dispersion coefficient is done successfully, and a layer of nickel is coated on the surface of polystyrene spheres using chemical plating method well.

Info:

Periodical:

Advanced Materials Research (Volumes 194-196)

Edited by:

Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang

Pages:

643-647

DOI:

10.4028/www.scientific.net/AMR.194-196.643

Citation:

J. Ma et al., "Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films", Advanced Materials Research, Vols. 194-196, pp. 643-647, 2011

Online since:

February 2011

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$35.00

[1] Z. W. Zhong: J. Elec. Packg. Forum Vol. 127(2005), pp.29-32.

[2] Watanabe I, Fujinawa T, Arifuku M, Fujii M and Gotoh Y In: Proceedings of the 9th IEEE international symposium on advanced packaging materials: processes, properties and interfaces, Atlanta, GA, 2004, p.11.

[3] J. Liu Mater. Technol. Forum Vol. 10(1995), pp.247-252.

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