Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films
Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect applications. In this paper, a new kind of polymer-based conductive particle used in anisotropic conductive adhesive films (ACFs) is prepared. The preparation of the single scattered polystyrene spheres with the particle size of 3 microns around and the less than 5% dispersion coefficient is done successfully, and a layer of nickel is coated on the surface of polystyrene spheres using chemical plating method well.
Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang
J. Ma et al., "Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films", Advanced Materials Research, Vols. 194-196, pp. 643-647, 2011