Temperature Field Simulation Analysis of High Temperature Box

Abstract:

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High temperature box is wildly used in many fields. Alone with the increasing of the requirement temperature, the temperature of it becomes more and more high. But it is difficult to test the temperature when the temperature is greater than 2000°C. In this paper, the thermal field of high temperature box is analyzed by finite element method, the result show that the temperature satisfies the design objects.

Info:

Periodical:

Advanced Materials Research (Volumes 211-212)

Edited by:

Ran Chen

Pages:

925-929

DOI:

10.4028/www.scientific.net/AMR.211-212.925

Citation:

W. X. Qian et al., "Temperature Field Simulation Analysis of High Temperature Box", Advanced Materials Research, Vols. 211-212, pp. 925-929, 2011

Online since:

February 2011

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Price:

$35.00

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