Advances in Key Engineering Materials

Volume 214

doi: 10.4028/www.scientific.net/AMR.214

Advances in Key Engineering Materials

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
These proceedings consist of the fully refereed papers presented at the International Conference on Key Engineering Materials (ICKEM 2011) held on March 25 - 27, 2011 in Sanya, China. The main aim was to provide an international scientific forum for the exchange of new ideas in a number of fields via in-depth discussions with peers from around the world. Both inward research; core areas of key engineering materials and outward research; multi-disciplinary, inter-disciplinary, and applications are covered in this timely work.

Review from Ringgold Inc., ProtoView: The attendees of the March 2011 conference were primarily Chinese materials science professors gathered to discuss advances in ceramics, metal alloys, polymer composites, crystals, and powders for the manufacturing and electronics industries. Four papers from the University of Malaysia model crack interaction among multiple cracks, surface cracks in round bars under combined loading, and stress intensity factors using ANSYS finite element analysis. Three papers from the Inner Mongolia University of Technology test the digital printing performance of cashmere fabrics and the imitation of batik patterns. Seemingly unrelated topics include combining computer graphics with drawings to create art, estimating bandwidth quality in a network, and the location of waste transfer stations.

Info:

ISBN-13:
978-3-03785-063-3
Editors:
Zeng Zhu
Pages:
726
Year:
2011
Edition:
softcover

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