Preparation and Dielectric Properties of Polyimide Nanocomposite Films Based on Hollow Silica

Abstract:

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The hollow silica was fabricated by using monodispersed polystyrene microspheres as core template and tetraethyl orthosilicate as silica source, and polyimide nanocomposite films with different hollow silica concentration were successfully prepared via in situ polymerization. The hollow silica and nanocomposite films were characterized. The results indicated that the diameter of the hollow silica is around 30nm and the dielectric constant of the nanocomposite films enhance with the increase of the concentration of the hollow silica.

Info:

Periodical:

Advanced Materials Research (Volumes 217-218)

Edited by:

Zhou Mark

Pages:

647-651

DOI:

10.4028/www.scientific.net/AMR.217-218.647

Citation:

Y. Li et al., "Preparation and Dielectric Properties of Polyimide Nanocomposite Films Based on Hollow Silica", Advanced Materials Research, Vols. 217-218, pp. 647-651, 2011

Online since:

March 2011

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Price:

$35.00

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