Joining Phenomena of Resistance Spot Welded Joint between Titanium and Aluminum Alloy


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In order to obtain a robust dissimilar joint between titanium and aluminum alloy, a method of resistance spot welding with a cover plate were used to weld two kinds of material. The interfacial microstructure was observed using transmission electron microscopy. The effects of welding parameters on the mechanical properties of the joint were investigated. An approximately 160 nm thick layer of Al solid solution supersaturated with Ti was observed at the welding interface, in which contain the precipitates TiAl3. Mechanical property analysis suggests that the reaction layer has no effect on the tensile shear load of the joint.



Advanced Materials Research (Volumes 230-232)

Edited by:

Ran Chen and Wenli Yao




R. F. Qiu et al., "Joining Phenomena of Resistance Spot Welded Joint between Titanium and Aluminum Alloy", Advanced Materials Research, Vols. 230-232, pp. 982-986, 2011

Online since:

May 2011




[1] A. Heinz, A. Haszler, C. Keidel, S. Moldenhauer, R. Benedictus and W. S. Miller: Mater. Sci. Eng. A, Vol. 280 (2000), p.102–107.

[2] N. Kahraman, B. Gulenc and F. Findik: Int. J. Impact Eng., Vol. 34 (2007), P. 1423–1432.

[3] K. Katoh and H. Tokisue: Journal of Japan Institute of Light Metals , Vol. 54-10 (2004), pp.430-435.

[4] J. W. Ren, Y. J. Li and T. Feng: Mater. Lett., Vol. 56 (2002), p.647–652.

[5] R. Qiu., C. Iwamoto and S. Satonaka: Journal of Materials Processing Technology, Vol. 209 (2009), pp.4186-4193.

[6] S. Satonaka, K. Kaieda and S. Okamoto: Welding in the world, Vol. 48-5/6 (2004), pp.39-45.

[7] R. Qiu, S. Satonaka and C. Iwamoto: Sci Technol Weld Join, Vol. 14-8 (2009), pp.691-697.

[8] Ichikawa Riei and Ohashi Teruo: Journal of the Japan Welding Society, Vol. 48-10 (1979), P. 25-31.

[9] American National Standard: ANSI/AWS/SAE/D8. 9 – 97 (1997), Section 5. 7.

[10] K. Nishio, M. Katoh, T. Yamaguchi, H. Era and K. Sakamoto: Quarterly Journal of the Japan Welding Society, Vol. 22-2 (2004), pp.254-260.