Preparation of HBWSL-1 Type Photosensitive Resin for Stereolithography and Study on the Accuracy of its Fabricated Parts
HBWSL-1 type photosensitive resin for Stereolithography was prepared with bisphenol A type epoxy diacrylate (EA-612), polyethene glycol (200) diacrylate (PEGDA), ethoxylated trimethyolpropane triacrylate (EO3TMPTA), cycloaliphatic diepoxide (ERL-4221), polycaprolactone polyol(Polyol-0301), 1-hydroxycyclohexyl phenyl ketone (Irgacure184) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976). The main parameters of the photosensitive resin were as follows: the penetration depth was 0.15mm, the critical exposure was 16.6mJ/cm2, the viscosity at 30°C was 215mPa.s, and the density at 30°C was 1.13g/cm3. With the photosensitive resin as the processing material, cuboid parts and double-cantilever parts were fabricated by using a stereolithography apparatus, and the dimension shrinkage factor and the curl factor were studied. The shrinkage factor was less than 1.00%, and the curl factor was less than 8.00%, which showed that the accuracy of the fabricated parts was high with the photosensitive resin for stereolithography.
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
B. W. Huang et al., "Preparation of HBWSL-1 Type Photosensitive Resin for Stereolithography and Study on the Accuracy of its Fabricated Parts", Advanced Materials Research, Vols. 239-242, pp. 3043-3047, 2011