Preparation of HBWSL-1 Type Photosensitive Resin for Stereolithography and Study on the Accuracy of its Fabricated Parts

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HBWSL-1 type photosensitive resin for Stereolithography was prepared with bisphenol A type epoxy diacrylate (EA-612), polyethene glycol (200) diacrylate (PEGDA), ethoxylated trimethyolpropane triacrylate (EO3TMPTA), cycloaliphatic diepoxide (ERL-4221), polycaprolactone polyol(Polyol-0301), 1-hydroxycyclohexyl phenyl ketone (Irgacure184) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976). The main parameters of the photosensitive resin were as follows: the penetration depth was 0.15mm, the critical exposure was 16.6mJ/cm2, the viscosity at 30°C was 215mPa.s, and the density at 30°C was 1.13g/cm3. With the photosensitive resin as the processing material, cuboid parts and double-cantilever parts were fabricated by using a stereolithography apparatus, and the dimension shrinkage factor and the curl factor were studied. The shrinkage factor was less than 1.00%, and the curl factor was less than 8.00%, which showed that the accuracy of the fabricated parts was high with the photosensitive resin for stereolithography.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

3043-3047

DOI:

10.4028/www.scientific.net/AMR.239-242.3043

Citation:

B. W. Huang et al., "Preparation of HBWSL-1 Type Photosensitive Resin for Stereolithography and Study on the Accuracy of its Fabricated Parts", Advanced Materials Research, Vols. 239-242, pp. 3043-3047, 2011

Online since:

May 2011

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Price:

$35.00

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