Micro-Scratch Analysis on Adhesion between Thin Films and PES Substrate


Article Preview

In flexible display, reliability of the thin film/polymer interface is an important issue because adhesion strength dissimilar materials is often inherently poor, and residual stresses arising from thermal mismatches or pressure exerted by vaporized moisture often lead to delaminations of interfaces. In the present study we deposited various thin films such as silicon nitride (SiNx), aluminum metal layer, and indium tin oxide on polyether sulphone (PES) substrate. The film adhesion was determined by micro-scratch test. The adhesion strength, presented by the critical load, Lc, when the film starts to delaminate, was determined as a function of plasma pretreated on PES substrate.



Advanced Materials Research (Volumes 26-28)

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee




S. H. Lee et al., "Micro-Scratch Analysis on Adhesion between Thin Films and PES Substrate", Advanced Materials Research, Vols. 26-28, pp. 1153-1156, 2007

Online since:

October 2007




[1] J. Mort, F. Jansen (Eds. ), Plasma Deposition of Thin Films, CRC Press, Boca Raton, FL, (1986).

[2] L. Martinu, in: R. d' Agostino, Fracass, P. Favia (Eds. ), Plasma Treatments and Deposition of Polymers, Kluwer Arcademic Publishers, Dordrecht, 1997, p.247.

[3] J. Valli, J. Vac. Sci. Technol. A 4 (1986) 3007.

[4] P. Benjamin, C Weaver, Proc. R. soc. London Ser. A 254 (1960) 163.

[5] M.T. Laugier, Thin Solid Films 117 (1984) 243.

[6] P. Steinmann, Y. Tardy, H.E. Hintermann, Thin Solid Films 154 (1987) 333.

[7] A. J. Kinoch, J. Mater. Sci, 15 (1980) 2141.

[8] S. M Kim, C. Park, S.S. Im, J. Kor Fiber Soc. Vol. 39, No. 4, (2002).

[9] M. Ohring, Materials Science of Thin Films, pp.732-733, Academic Press, (2002).