Micro-Scratch Analysis on Adhesion between Thin Films and PES Substrate

Abstract:

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In flexible display, reliability of the thin film/polymer interface is an important issue because adhesion strength dissimilar materials is often inherently poor, and residual stresses arising from thermal mismatches or pressure exerted by vaporized moisture often lead to delaminations of interfaces. In the present study we deposited various thin films such as silicon nitride (SiNx), aluminum metal layer, and indium tin oxide on polyether sulphone (PES) substrate. The film adhesion was determined by micro-scratch test. The adhesion strength, presented by the critical load, Lc, when the film starts to delaminate, was determined as a function of plasma pretreated on PES substrate.

Info:

Periodical:

Advanced Materials Research (Volumes 26-28)

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

1153-1156

DOI:

10.4028/www.scientific.net/AMR.26-28.1153

Citation:

S. H. Lee et al., "Micro-Scratch Analysis on Adhesion between Thin Films and PES Substrate", Advanced Materials Research, Vols. 26-28, pp. 1153-1156, 2007

Online since:

October 2007

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Price:

$35.00

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