Microstructures of Ni/Cu and Ni-Co/Cu Multilayers Produced by Electrodeposition Method

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Microstructures of Ni/Cu and Ni-Co/Cu multilayers were investigated by X-ray diffraction analysis. These multilayered structures were fabricated on copper substrates using electrodeposition technique. At an as-deposited Ni/Cu multilayer with the layer thickness of h=5nm, a single diffraction peak appeared, although the multilayer of h=100nm exhibited the diffractions splitting into two peaks which resulted from both the Ni and Cu layers. In the Ni-Co/Cu multilayers, it was found that composition of the Ni-Co layer depended on an electric potential applied during deposition. The fcc and hcp structures were detected at the Ni-rich and the Co-rich deposits, respectively. The Vickers hardness of the Co-Ni/Cu multilayer was higher than that of the Ni/Cu multilayer.

Info:

Periodical:

Advanced Materials Research (Volumes 26-28)

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

1321-1324

DOI:

10.4028/www.scientific.net/AMR.26-28.1321

Citation:

Y. Kaneko et al., "Microstructures of Ni/Cu and Ni-Co/Cu Multilayers Produced by Electrodeposition Method", Advanced Materials Research, Vols. 26-28, pp. 1321-1324, 2007

Online since:

October 2007

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Price:

$38.00

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